Displacement Measurement Through Digital Image Correlation and Digital Speckle Pattern Interferometry Techniques in Cold-Expanded Holes

In this paper, the displacement field induced by the split-sleeve cold expansion of holes was measured using both digital image correlation (DIC) and digital speckle pattern interferometry (DSPI) techniques. Thus, the experimental results, which were evaluated on the inlet surface of a 6082-T6 aluminium plate, were compared with those from theoretical prediction. DIC provided accurate measurements up to the elastic-plastic boundary, whereas the DSPI technique highlighted the changes of displacement in the elastic domain. Prediction of the displacement based on the existing analytical model agreed with the experimental results achieved with both techniques. Possible explanations for the differences are discussed.