☆ 4.3 Article

Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue

SOLDERING & SURFACE MOUNT TECHNOLOGY (2008)

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SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 20, Issue 1, Pages 13-21

Publisher

Emerald
DOI: 10.1108/09540910810861440

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Metallurgy & Metallurgical Engineering

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