Journal
SMALL
Volume 7, Issue 4, Pages 484-491Publisher
WILEY-BLACKWELL
DOI: 10.1002/smll.201001633
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Funding
- Gwangju Institute of Science Technology
- Ministry of the Knowledge Economy of Korea [10033871]
- Ministry of Education, Science and Technology [2009-0077160]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10033871] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [2009-0077160] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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The ability to create and manipulate large arrays of inorganic semiconductor micro/nanostructures for integration on unconventional substrates provides new possibilities in device engineering. Here, simple methods are described for the preparation of structures of single crystalline silicon in suspended and tethered configurations that facilitate their deterministic assembly using transfer-printing techniques. Diverse shapes (e.g., straight or curved edges), thicknesses (between 55 nm and 3 mu m), and sizes (areas of 4000 mu m(2) to 117 mm(2)) of structures in varied layouts (regular or irregular arrays, with dense or sparse coverages) can be achieved, using either flat or cylindrical roller-type stamps. To demonstrate the technique, printing with 100% yield onto curved, rigid supports of glass and ceramics and onto thin sheets of plastic is shown. The fabrication of a printed array of silicon p(+)-i-n(+) junction photodiodes on plastic is representative of device-printing capabilities.
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