Related references
Note: Only part of the references are listed.Improving the performance of lead-free solder reinforced with multi-walled carbon narlotubes
S. M. L. Nai et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
K. Mohan Kumar et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation
X Deng et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2004)
An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder
DC Lin et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2003)
Preparation of tin nanoparticles by solution dispersion
YB Zhao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2003)
Lead-free solders in microelectronics
M Abtew et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2000)
Share Paper
