4.8 Article

Nanostructured copper interfaces for enhanced boiling

Journal

SMALL
Volume 4, Issue 8, Pages 1084-1088

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.200700991

Keywords

copper; heat transfer; interfaces; nanorods; nucleate boiling

Funding

  1. National Science Foundation [CEBT-0721246, ECS 0403789, ECS 0506738]

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