Journal
SENSORS AND ACTUATORS A-PHYSICAL
Volume 283, Issue -, Pages 65-78Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2018.09.035
Keywords
Nanoindentation; Contact stiffness; Nanoimprint lithography; Silicon pillar; Dry etching; Cryogenic
Funding
- Braunschweig International Graduate School of Metrology (B-IGSM)
- DFG Research Training Group [GrK1952/1]
- German Research Foundation (DFG) [PE 885/3-1]
- Ministry of Research, Technology and Higher Education of the Republic of Indonesia (RISTEKDIKTI) [344/RISET-Pro/FGS/VIII/2016]
- Indonesian-German Center for Nano and Quantum Technologies (IG-Nano)
- Lower Saxony Ministry for Science and Culture (N-MWK)
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Nanomechanical properties of bulk and micro-pillared monocrystalline silicon are experimentally investigated using nanoscale depth-sensing indentation technique. Silicon pillar arrays with different crystal orientations, i.e., Si < 100 >, Si < 110 >, and Si < 111 >, are prepared by means of a top-down approach consisting of nanoimprint lithography and cryogenic dry etching. A three-sided Berkovich tip used during the experiments has provided highly resolved load-depth-curves and imprinted hardness impressions on the silicon materials. Depending on the aspect ratio of the pillars, the axial stiffness of the objects under measurement has to be considered. Corrected values of the elastic modulus are determined revealing direct nanomechanical comparison between silicon bulk and pillar structures. In summary, enhanced comprehension of elastic-plastic-response occurred within micro-structured silicon materials is shown, providing the potential to use silicon pillar arrays as fundamental material for accurate force measurements. (C) 2018 Elsevier B.V. All rights reserved.
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