Journal
SENSORS
Volume 18, Issue 7, Pages -Publisher
MDPI
DOI: 10.3390/s18072374
Keywords
tactile sensor; MEMS-CMOS integration; wafer level packaging; sensor network; through silicon via; benzocyclobutene
Funding
- Special Coordination Funds for Promoting Science and Technology
- Toyota Motor Corporation (Aichi, Japan)
- Toyota Central R & D Labs., Inc. (Aichi, Japan)
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Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5 x 2.5 x 0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 mu m thick BCB isolation layer and this minimum package structure.
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