4.4 Article

Monolithic Ge-on-Si lasers for large-scale electronic-photonic integration

Journal

SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Volume 27, Issue 9, Pages -

Publisher

IOP Publishing Ltd
DOI: 10.1088/0268-1242/27/9/094006

Keywords

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Funding

  1. US Air Force Office of Scientific Research's (AFOSR) Multidisciplinary University Research Initiative (MURI) on Silicon-Based Lasers
  2. Fully Laser Integrated Photonics (FLIP) program under APIC Corportation
  3. Naval Air Warfare Center-Aircraft Division (NAWC-AD) under OTA [N00421-03-9-0002]

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A silicon-based monolithic laser source has long been envisioned as a key enabling component for large-scale electronic-photonic integration in future generations of high-performance computation and communication systems. In this paper we present a comprehensive review on the development of monolithic Ge-on-Si lasers for this application. Starting with a historical review of light emission from the direct gap transition of Ge dating back to the 1960s, we focus on the rapid progress in band-engineered Ge-on-Si lasers in the past five years after a nearly 30-year gap in this research field. Ge has become an interesting candidate for active devices in Si photonics in the past decade due to its pseudo-direct gap behavior and compatibility with Si complementary metal oxide semiconductor (CMOS) processing. In 2007, we proposed combing tensile strain with n-type doping to compensate the energy difference between the direct and indirect band gap of Ge, thereby achieving net optical gain for CMOS-compatible diode lasers. Here we systematically present theoretical modeling, material growth methods, spontaneous emission, optical gain, and lasing under optical and electrical pumping from band-engineered Ge-on-Si, culminated by recently demonstrated electrically pumped Ge-on-Si lasers with >1 mW output in the communication wavelength window of 1500-1700 nm. The broad gain spectrum enables on-chip wavelength division multiplexing. A unique feature of band-engineered pseudo-direct gap Ge light emitters is that the emission intensity increases with temperature, exactly opposite to conventional direct gap semiconductor light-emitting devices. This extraordinary thermal anti-quenching behavior greatly facilitates monolithic integration on Si microchips where temperatures can reach up to 80 degrees C during operation. The same band-engineering approach can be extended to other pseudo-direct gap semiconductors, allowing us to achieve efficient light emission at wavelengths previously considered inaccessible.

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