Journal
SCRIPTA MATERIALIA
Volume 68, Issue 8, Pages 607-610Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2012.12.017
Keywords
Solder alloy; Low-temperature creep; Constitutive law; Fatigue; Lead-free solder
Categories
Funding
- China Scholarship Council
- National Natural Science Foundation of China [10772116]
- Advanced Materials for Micro and Nano Systems Programme of the Singapore-MIT Alliance (SMA)
- Office of Naval Research (ONR) [00014-08-1-0510]
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Creep tests covering a broad temperature range (-40 to 120 degrees C) were systematically performed on Pb5Sn and Sn3Ag0.5Cu solder alloys. Experimental results showed that both solder alloys creep significantly within the temperatures and stress levels tested. A single set of constitutive equations was constructed to describe creep deformation over a wide range of stress and temperature. Numerical analyses revealed that, when evaluating creep failure, significant errors may result from ignoring creep at low temperatures, especially for the lead-free solder alloy Sn3Ag0.5Cu. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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