Journal
SCRIPTA MATERIALIA
Volume 66, Issue 8, Pages 582-585Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2012.01.007
Keywords
Ag nanoparticle paste; Sintering; Pressureless bonding; Electronic packaging
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Funding
- National Natural Science Foundation of China [51075232]
- Tsinghua University Initiative [2010THZ 02-1]
- State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology [AWPT-Z12-04]
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We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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