Journal
SCRIPTA MATERIALIA
Volume 66, Issue 11, Pages 931-934Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2012.02.037
Keywords
Thermal interface material; Thermal conductivity; Bonding; Sintering
Categories
Funding
- State Key Laboratory of New Ceramic and Fine Processing at Tsinghua University
- Daikin Industries Ltd, Japan
Ask authors/readers for more resources
We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
