Journal
SCRIPTA MATERIALIA
Volume 66, Issue 6, Pages 355-358Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2011.11.030
Keywords
Copper; Ultrafine-grained microstructure; Fatigue; Shear bands; Grain coarsening
Categories
Funding
- Ministry of Education, Science and Culture of Japan [23560093]
- Fundamental R&D Program for Core Technology of Materials
- Ministry of Knowledge Economy, Republic of Korea
- Grants-in-Aid for Scientific Research [23560093] Funding Source: KAKEN
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Fatigue tests of ultrafine-grained copper specimens were conducted. The crack growth direction under constant stress depended on the magnitude of the stress amplitude. It occurred perpendicular to the loading axis at low stresses and was inclined at 45 degrees to the loading axis at high stress. To clarify the different growth mechanisms between the high- and low-stress amplitudes, two-step fatigue stress tests were conducted. The crack path formation under high- and low-stress amplitude is discussed from the viewpoint of the evolution of damaged areas around the crack. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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