Journal
SCRIPTA MATERIALIA
Volume 64, Issue 9, Pages 856-859Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2011.01.021
Keywords
Dealloy; Nanostructured material; Porous material; Thin films; Surface diffusion
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Funding
- American Association of University Women (AAUW)
- Achievement Rewards for College Scientists (ARCS) Foundation
- University of Arizona
- University of Arizona Honors College
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AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 degrees C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/ void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 +/- 2.37 kJ mol(-1), which is less than half that reported for AgAu alloys. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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