Journal
SCRIPTA MATERIALIA
Volume 65, Issue 12, Pages 1097-1100Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2011.09.028
Keywords
Auger electron spectroscopy (AES); Metal matrix composites (MMCs); Coatings; Interface structure; Thermal conductivity
Categories
Funding
- Ministry of Education of China [707007]
- Beijing Municipal Commission of Education [2008100071601Y]
- Program for New Century Excellent Talents in University
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Cu matrix composites reinforced with Ti-coated diamond particles were consolidated by spark plasma sintering. A layered structure of TiC/transition layer was formed uniformly on the diamond particle surface, with a total thickness of similar to 285 nm. A high thermal conductivity of 493 W m(-1) K-1 was achieved in the Cu/Ti-coated diamond composites. The greatly enhanced thermal conductivity is ascribed to the 285 nm thick Ti coating. Ti coating on diamond particles is therefore an effective way to enhance the thermal conductivity of Cu/diamond composites. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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