Journal
SCRIPTA MATERIALIA
Volume 65, Issue 2, Pages 163-166Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2011.04.001
Keywords
Nanostructured materials; Implantation; Thin films; Creep test
Categories
Funding
- US DOE-BES [DEFG02-05ER46217]
- US Department of Energy [DE-FG02-07ER46453, DE-FG02-07ER46471]
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Irradiation-induced creep measurements were performed on pure Cu and Cu(93.5)W(6.5). By using 1.8 MeV Kr(+) irradiation of freestanding 300 nm films, nearly homogeneous damage in excess of 100 dpa could be obtained, yielding transient and steady-state creep regimes. The steady-state creep rate was proportional to the applied stress, yielding irradiation creep compliance of 1.2 and 0.32 x 10(-4) MPa(-1) dpa(-1) in Cu and Cu(93.5)W(6.5), respectively. The microstructure of the two-phase alloy was highly stable but that of pure Cu was not. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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