4.7 Article

Copper-rubber interface delamination in stretchable electronics

Journal

SCRIPTA MATERIALIA
Volume 63, Issue 8, Pages 875-878

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2010.06.041

Keywords

Mechanical properties testing; Scanning electron microscopy; Layered structures; Interfaces

Funding

  1. University of Berlin
  2. European Commission [IST-028026]

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Interface delamination in metal-rubber-type stretchable electronic systems leads to early failure. This paper reports an investigation of metal rubber interfaces through in situ scanning electron microscopy imaging of the progressing delamination front of 90 degrees peel tests of rubber on copper samples. The results show that the energy dissipated in the forming, elongation and rupture of similar to 50 mu m long fibrils constitutes the major part of the work of separation. The experiments are characterized and modeled using a cohesive zone-enriched finite-element model. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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