Journal
SCRIPTA MATERIALIA
Volume 59, Issue 2, Pages 195-198Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2008.03.014
Keywords
nickel film; nanoindentation; creep; stress exponent
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Nanoindentation creep tests have been performed under a constant rate P/P = 0.1 s(-1) with the holding load ranging from 1000 to 9000 mu N to investigate the dependence of indentation creep behavior of Ni films. The results show that the creep rate, creep stain rate, indentation stress and even stress exponents are all indentation depth dependent. Based on the experimental results, it is inferred that the creep is likely dominated by grain boundary sliding and a grain rotation mechanism for small indentation loads but by dislocation climb for large indents. Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
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