Journal
SCIENCE CHINA-INFORMATION SCIENCES
Volume 57, Issue 6, Pages -Publisher
SCIENCE PRESS
DOI: 10.1007/s11432-013-4982-7
Keywords
silicon-oxide-nitride-oxide-silicon; SONOS; total ionizing dose; TID; flash memory; radiation effects; 130 nm
Funding
- National Basic Research Program of China [2011CBA00602]
- National Natural Science Foundation of China [61106102, 61176033]
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In this paper, we have studied the total ionizing dose (TID) radiation response up to 2 Mrad(Si) of silicon-oxide-nitride-oxide-silicon (SONOS) memory cells and memory circuits, fabricated in a 130 nm complimentary metal-oxide-semiconductor (CMOS) SONOS technology. We explored the threshold voltage (V-T) degradation mechanism and found that the V-T shifts of SONOS cells depend on the charge state; simply programming the cell to a higher V-T cannot compensate for the radiation induced V-T loss. The off-state current (I-off) increase in the SONOS cell is also studied in this paper. Both V-T and I-off degradation would affect the memory system. Read data failures are mainly caused by V-T shifts under irradiation, and program and erase failures are mainly caused by increased I-off, which overloads the charge pumping circuit. By varying the reference current, our 4 Mb NOR flash chip has the potential to survive a radiation dose of 1 Mrad(Si) in read mode.
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