Journal
SCIENCE
Volume 325, Issue 5943, Pages 977-981Publisher
AMER ASSOC ADVANCEMENT SCIENCE
DOI: 10.1126/science.1175690
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Funding
- Ford Motor Company
- NSF [DMI-0328162]
- U.S. Department of Energy, Division of Materials Sciences [DE-FG02-07ER46471]
- Materials Research Laboratory and Center for Microanalysis of Materials at the University of Illinois at Urbana-Champaign [DE-FG02-07ER46453]
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [0747178] Funding Source: National Science Foundation
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [824129] Funding Source: National Science Foundation
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We have developed methods for creating microscale inorganic light-emitting diodes (LEDs) and for assembling and interconnecting them into unusual display and lighting systems. The LEDs use specialized epitaxial semiconductor layers that allow delineation and release of large collections of ultrathin devices. Diverse shapes are possible, with dimensions from micrometers to millimeters, in either flat or wavy configurations. Printing-based assembly methods can deposit these devices on substrates of glass, plastic, or rubber, in arbitrary spatial layouts and over areas that can be much larger than those of the growth wafer. The thin geometries of these LEDs enable them to be interconnected by conventional planar processing techniques. Displays, lighting elements, and related systems formed in this manner can offer interesting mechanical and optical properties.
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