Journal
ROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING
Volume 27, Issue 5, Pages 949-962Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.rcim.2011.03.007
Keywords
Automatic PCB inspection; Segmentation of solder joint; Classification of solder joint; Log-Gabor filter; Classifier fusion
Ask authors/readers for more resources
Inspection of solder joints has been a critical process in the electronic manufacturing industry to reduce manufacturing cost, improve yield, and ensure product quality and reliability. This paper proposes two inspection modules for an automatic solder joint classification system. The front-end inspection system includes illumination normalisation, localisation and segmentation. The back-end inspection involves the classification of solder joints using the Log-Gabor filter and classifier fusion. Five different levels of solder quality with respect to the amount of solder paste have been defined. The Log-Gabor filter has been demonstrated to achieve high recognition rates and is resistant to misalignment. This proposed system does not need any special illumination system, and the images are acquired by an ordinary digital camera. This system could contribute to the development of automated non-contact, non-destructive and low cost solder joint quality inspection systems. (C) 2011 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available