4.5 Article

Anodically bonded submicron microfluidic chambers

Journal

REVIEW OF SCIENTIFIC INSTRUMENTS
Volume 81, Issue 1, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.3291107

Keywords

anodisation; electrodes; microfluidics; silicon; silicon compounds

Funding

  1. NSF through the Cornell Materials Science Center [DMR-0457533, DMR 0520404]
  2. EPSRC [EP/E054129/1, EP/C522877/1]
  3. Division Of Materials Research [0806629] Funding Source: National Science Foundation
  4. Engineering and Physical Sciences Research Council [EP/E054129/1, EP/C522877/1] Funding Source: researchfish

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We demonstrate the use of anodic bonding to fabricate cells with characteristic size as large as 7x10 mm(2), with height of approximate to 640 nm, and without any internal support structure. The cells were fabricated from Hoya SD-2 glass and silicon wafers, each with 3 mm thickness to maintain dimensional stability under internal pressure. Bonding was carried out at 350 degrees C and 450 V with an electrode structure that excluded the electric field from the open region. We detail fabrication and characterization steps and also discuss the design of the fill line for access to the cavity.

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