Journal
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE
Volume 225, Issue B7, Pages 1153-1162Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/2041297510393620
Keywords
wire saw; surface waviness; ceramic; model
Funding
- National Science Foundation (NSF) of the USA
Ask authors/readers for more resources
In the photovoltaic and semiconductor industries silicon wafers are sliced using the wire saw process. This process is also used to machine almost all kinds of brittle materials where high yield and low surface damage is desired. The wire saw process induces roughness and long waviness on the cut surface. These defects have to be removed by post-process techniques including grinding and lapping, which increases costs. The present study investigated the long waviness induced by the wire saw process. An analytical model for long waviness generation has been developed. Experimental work was conducted with different process parameters. The analytical model is capable of explaining the long waviness generation observed in experimental work. Process design recommendations with minimal waviness and high efficiency are presented.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available