Journal
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE
Volume 224, Issue B10, Pages 1511-1518Publisher
PROFESSIONAL ENGINEERING PUBLISHING LTD
DOI: 10.1243/09544054JEM1863
Keywords
silicon carbide ceramics; surface integrity; machining performance; electric discharge milling; mechanical grinding
Funding
- Chinese National Natural Science Foundation [50675225]
- Department of Science and Technology of Shandong Province [2006GG2204001]
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A new combined process that integrates electrical discharge milling and mechanical grinding is presented. The process is able effectively to machine a large surface area on SiC ceramic with a good surface quality and low cost. The effects of machining conditions on the material removal rate, relative electrode wear ratio, and surface roughness were investigated. The surface microstructures machined by the new process were observed by a scanning electron microscope (SEM), an X-ray diffraction, and an energy dispersive spectrometer. The SEM micrographs show that the surfaces machined at rough machining mode and semi-finish machining mode are characterized by an uneven fusing structure, globules of debris, shallow craters, and micropores; the surface machined at finish machining mode is smooth, and covered by fewer little craters and pockmarks.
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