Preparation of Ti-Ni binary powder via electroless nickel plating of titanium powder

In this study, Ti powder (average size: 45 mu m) was plated/coated by electroless Ni with hydrazine hydrate as reductant. The Ni plating was carried out at 85 degrees C and pH 9-10. The influence of process parameters such as plating period as well as reductant concentration was investigated. The Ni plated Ti powder was characterised by scanning electron microscopy, energy dispersive spectrometer analysis and X-ray fluorescence. It is found that a pure/uniform Ni layer may be deposited on the Ti powder particles. The deposited mass increases as plating period/reductant concentration increases.