3.9 Article

Flame-Retardant, Thermal, Mechanical and Dielectric Properties of Structural Non-Halogenated Epoxy Resin Composites

Journal

POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING
Volume 51, Issue 12, Pages 1198-1203

Publisher

TAYLOR & FRANCIS INC
DOI: 10.1080/03602559.2012.694951

Keywords

Dielectric properties; Flame-retardant; Phenolic aldehyde curing agent (MFP); Structural non-halogenated epoxy resin (ED); Thermal stabilities

Funding

  1. NWPU [JC20100219]
  2. Higher School the Special Research Fund for the Doctoral Program Project [20116102120044]

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First, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and epoxy resin (E-51) were employed to synthesize a structural non-halogenated epoxy resin (ED). And a novelphenolic aldehyde curing agent, 2,4,6-tri (phenol-methylene-amide)-triazine (MFP) was also synthesized for preparing high-performance MFP/ED composites. Results showed that, the flame-retardant and thermal stabilities of the composites were improved with the increasing phosphorus content. When the content of phosphorus was 3wt%, the initial decomposing temperature of the composite was over 325 degrees C, and the charring rate was 30.3% at 650 degrees C, could meet the requirements of UL 94-V0 rating. However, all the flexural and impact, dielectric constant and loss and the glass transition temperature (Tg) of the composites were decreased with the increasing phosphorus content.

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