4.7 Article

Online monitoring of thermoset post-curing by dynamic mechanical thermal analysis DMTA

Journal

POLYMER TESTING
Volume 28, Issue 6, Pages 561-566

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.polymertesting.2009.02.005

Keywords

DMTA; Moulding compound; Thermoset; Phenolic resin; Post-curing

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Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time-temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin. (C) 2009 Elsevier Ltd. All rights reserved.

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