Journal
POLYMER
Volume 49, Issue 21, Pages 4666-4672Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.polymer.2008.08.023
Keywords
Thermal conduction mechanism; Nano-SiC/DGEBA/EMI-2,4 composites; FTIR
Categories
Funding
- National Natural Science Foundation of China [10776014]
- China Postdoctoral Science Foundation [20080431103]
- High Technical Foundation of Jiangsu Province of China [BG2007047]
- Natural Science Foundation of Jiangsu Province of China [BK2008407]
- Postdoctoral Research Funds [0801023B]
- Young Scholars of Nanjing University of Science Technology [A1341339]
- Scholars of Nanjing University of Science Technology [A1341980]
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This report covers the results of a study on identifying the thermal conduction mechanism of nano-sized SiC/diglycidyl ether of bisphenol-A glycidol ether epoxy resin/2-ethyl-4-methylimidazole (nano-SiC/DGEBA/EMI-2,4) composites. The analysis using FTIR provided an in-depth understanding about how the pretreatment of micro/nano-sized SiC (micro/nano-SiC) particles affects the surface structure of the two different-sized particles, and thereby results in the difference in particles/resin interface structures, which determine different thermal conduction mechanisms. The surface modification approaches included: (1) silane treatment using gamma-aminopropyl-triethoxysilane (A1100) and (2) oxidation followed by silane treatment. The results showed that, it is the structure of cross-linked SiC particles/resin three-dimensional network, established by chemical bonding, dominates the thermal conduction mechanism of nano-SiC/DGEBA/EMI-2,4 composites, and leads to the namocomposites with high thermal conductivity at low filler content. Meanwhile, thermal conduction chains, the prevailing thermal conduction mean in the micro-SiC/DGEBA/EMI-2,4 composites, are the secondary means to conduct thermal diffusion in the nanocomposites. (C) 2008 Elsevier Ltd. All rights reserved.
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