Journal
PHYSICAL REVIEW LETTERS
Volume 109, Issue 17, Pages -Publisher
AMER PHYSICAL SOC
DOI: 10.1103/PhysRevLett.109.175503
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- U.S. Department of Energy Office of Basic Energy Sciences [DE-FG02-07ER46459]
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Weak electron-phonon coupling in Au and Cu produces a significant thermal resistance when heat flows from a thin Pt layer into a thin Au or Cu layer on picosecond time scales. Metal bilayers (Pt/Au and Pt/Cu) were prepared by magnetron sputter deposition; thermal transport in the bilayers was studied by time domain thermoreflectance in the temperature range 38<300 K. Analysis of heat transfer in the bilayer yields the electron-phonon coupling parameter g(T) of Au and Cu. Our results for g(T) are consistent with the temperature dependence predicted by the two-temperature model of Kaganov et al. [Sov. Phys. JETP 4, 173 (1957)] and help bridge the gap between data obtained using pump-probe spectroscopy at room temperature and electrical measurements at low temperatures.
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