Related references
Note: Only part of the references are listed.Contribution of triple junctions to the diffusion anomaly in nanocrystalline materials
Ying Chen et al.
SCRIPTA MATERIALIA (2007)
Atomic mechanisms of grain boundary diffusion: Low versus high temperatures
A Suzuki et al.
JOURNAL OF MATERIALS SCIENCE (2005)
On the design of controlled tricrystal specimens for the systematic investigation of static grain boundary triple junction properties
R Kremer et al.
JOURNAL OF MATERIALS SCIENCE (2005)
Interaction of point defects with grain boundaries in fcc metals
A Suzuki et al.
INTERFACE SCIENCE (2003)
AtomEye: an efficient atomistic configuration viewer
J Li
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING (2003)
Atomistic modeling of point defects and diffusion in copper grain boundaries
A Suzuki et al.
INTERFACE SCIENCE (2003)
Triple junction diffusion and plastic flow in fine-grained materials
AA Fedorov et al.
SCRIPTA MATERIALIA (2002)
Molecular dynamics simulation of triple junction migration
M Upmanyu et al.
ACTA MATERIALIA (2002)
Structural stability and lattice defects in copper:: Ab initio, tight-binding, and embedded-atom calculations -: art. no. 224106
Y Mishin et al.
PHYSICAL REVIEW B (2001)
Direct experimental observation of accelerated Zn diffusion along triple junctions in Al
B Bokstein et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
Creep and superplasticity in nanocrystalline materials: current understanding and future prospects
FA Mohamed et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
Share Paper
