Journal
PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS
Volume 245, Issue 10, Pages 2303-2307Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/pssb.200879553
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The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. (C) 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
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