Journal
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
Volume 211, Issue 3, Pages 587-594Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/pssa.201330237
Keywords
B addition; Cu; diamond composites; high temperature-high pressure; interface; thermal conductivity
Funding
- National Natural Science Foundation of China [51271017]
- Fundamental Research Funds for the Central Universities [FRF-TP-13-033A]
- Program for New Century Excellent Talents in University [NCET-10-0227]
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In order to obtain high thermal conductivity materials for efficient heat sink applications, diamond particles dispersed CuB alloy matrix composites (CuB/diamond composites) containing diamond as high as 90vol.% were produced by a high temperature-high pressure infiltration method. The thermal conductivity of the Cu-0.3wt.%B/diamond composite was measured to be 731Wm(-1)K(-1). The presence of B4C on the surface of diamond was identified by Raman scattering. The influence of B addition on interface microstructure was clarified to interpret the thermal conductivity enhancement. The results show that B addition can improve the thermal conductivity of Cu/diamond composites produced by high temperature-high pressure infiltration method.
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