Comparison of the thermal shock performance of different tungsten grades and the influence of microstructure on the damage behaviour

The thermal shock performances of two new tungsten grades with 1 and 5 wt% of tantalum were characterized with the electron beam facility JUDITH 1. As a reference material, ultra-high-purity tungsten (W-UHP) with a purity of 99.9999 wt% was used. The induced thermal shock crack networks and surface modifications were analysed by a scanning electron microscope, light microscopy and laser profilometry. Damage and cracking thresholds were defined for all materials as a function of absorbed power density and base temperature. The materials showed significantly different thermal shock behaviour, which is, among others, expressed by differences in cracking patterns, i.e. crack distance and depth. These results allow us to quantify the influence of the materials' mechanical and thermal properties on the thermal shock performance. Furthermore, the specific grain structure of the materials has a significant influence on crack propagation towards the bulk material.