Related references
Note: Only part of the references are listed.Recent progress in thin film epitaxy across the misfit scale (2011 Acta Gold Medal Paper)
J. Narayan
ACTA MATERIALIA (2013)
Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings
Tiffany D. Ziebell et al.
JOURNAL OF MATERIALS RESEARCH (2012)
Deformation twinning in nanocrystalline materials
Y. T. Zhu et al.
PROGRESS IN MATERIALS SCIENCE (2012)
The Active Site of Methanol Synthesis over Cu/ZnO/Al2O3 Industrial Catalysts
Malte Behrens et al.
SCIENCE (2012)
Nanoscale planar faulting in nanocrystalline Ni-W thin films: Grain growth, segregation, and residual stress
Udo Welzel et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Effect of grain size on the competition between twinning and detwinning in nanocrystalline metals
S. Ni et al.
PHYSICAL REVIEW B (2011)
Double-inverse grain size dependence of deformation twinning in nanocrystalline Cu
Jin-Yu Zhang et al.
PHYSICAL REVIEW B (2010)
Formation of single and multiple deformation twins in nanocrystalline fcc metals
Y. T. Zhu et al.
ACTA MATERIALIA (2009)
Twinning partial multiplication at grain boundary in nanocrystalline fcc metals
Y. T. Zhu et al.
APPLIED PHYSICS LETTERS (2009)
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
K. Lu et al.
SCIENCE (2009)
Influence of stacking fault energy on deformation mechanism and dislocation storage capacity in ultrafine-grained materials
Z. W. Wang et al.
SCRIPTA MATERIALIA (2009)
Self-thickening, cross-slip deformation twinning model
J. Narayan et al.
APPLIED PHYSICS LETTERS (2008)
Determining the optimal stacking fault energy for achieving high ductility in ultrafine-grained Cu-Zn alloys
Y. H. Zhao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2008)
Inverse grain-size effect on twinning in nanocrystalline Ni
X. L. Wu et al.
PHYSICAL REVIEW LETTERS (2008)
New deformation twinning mechanism generates zero macroscopic strain in nanocrystalline metals
X. L. Wu et al.
PHYSICAL REVIEW LETTERS (2008)
Observation of atomic diffusion at twin-modified grain boundaries in copper
Kuan-Chia Chen et al.
SCIENCE (2008)
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
X. H. Chen et al.
JOURNAL OF APPLIED PHYSICS (2007)
Structural evolution in nano-crystalline Cu synthesized by high energy ball milling
S. Sheibani et al.
MATERIALS LETTERS (2007)
Simultaneously increasing the ductility and strength of ultra-fine-grained pure copper
Yong-Hao Zhao et al.
ADVANCED MATERIALS (2006)
Partial-dislocation-mediated processes in nanocrystalline Ni with nonequilibrium grain boundaries
X. L. Wu et al.
APPLIED PHYSICS LETTERS (2006)
High-pressure torsion-induced grain growth in electrodeposited nanocrystalline Ni
XZ Liao et al.
APPLIED PHYSICS LETTERS (2006)
Nucleation of deformation twins in nanocrystalline face-centered-cubic metals processed by severe plastic deformation
YT Zhu et al.
JOURNAL OF APPLIED PHYSICS (2005)
Ultrahigh strength and high electrical conductivity in copper
L Lu et al.
SCIENCE (2004)
Plastic deformation with reversible peak broadening in nanocrystalline nickel
Z Budrovic et al.
SCIENCE (2004)
Deformation twinning in nanocrystalline copper at room temperature and low strain rate
XZ Liao et al.
APPLIED PHYSICS LETTERS (2004)
Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper
E Ma et al.
APPLIED PHYSICS LETTERS (2004)
Nucleation and growth of deformation twins in nanocrystalline aluminum
YT Zhu et al.
APPLIED PHYSICS LETTERS (2004)
Deformation mechanism transitions in nanoscale fcc metals
RJ Asaro et al.
PHILOSOPHICAL MAGAZINE LETTERS (2003)
A maximum in the strength of nanocrystalline copper
J Schiotz et al.
SCIENCE (2003)
Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening
JY Huang et al.
ACTA MATERIALIA (2001)
Share Paper
