Journal
ORGANIC ELECTRONICS
Volume 12, Issue 2, Pages 227-233Publisher
ELSEVIER
DOI: 10.1016/j.orgel.2010.11.023
Keywords
Organic light-emitting diodes; Thin-film encapsulation; Heat transfer
Funding
- MKE/IITA [2009-F-016-01]
- Korea Evaluation Institute of Industrial Technology (KEIT) [2009-F-016-01] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [과06B2506] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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We investigate the heat transfer property of thin-film encapsulation (TFE) for organic light-emitting diodes (OLEDs). It is demonstrated that the TFE combined with a flexible heat sink shows better thermal performance, compared with the epoxy-filled glass encapsulation and the conventional glass encapsulation. By way of experiments and simulations, we verify that the multi-heterojunction configuration and the low thermal conductivity of the polymer layer in the TFE film have no impact on the thermal performance. Furthermore, we find through simulations that a significant temperature gradient appears inside the TFE layers only when the thermal conductivity of the polymer is lower than 1 x 10 (3) W/m K. This enables us to perform design optimization of the TFE configuration with relaxed heat dissipation. (C) 2010 Elsevier B.V. All rights reserved.
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