Journal
THIN SOLID FILMS
Volume 587, Issue -, Pages 39-42Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2014.11.068
Keywords
Perpendicular magnetic anisotropy; Annealing stability; Ta thickness
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Funding
- National Research Foundation of Korea (NRF) - Ministry of Education [NRF-2013R1A1A2060350]
- Global Ph.D. Fellowship Program through the National Research Foundation of Korea (NRF) - Ministry of Education [2012002282]
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We describe Ta underlayer thickness influence on thermal stability of perpendicular magnetic anisotropy in Ta/CoFeB/MgO/W stacks. It is believed that thermal stability based on Ta underlay is associated with thermally-activated Ta atom diffusion during annealing. The difference in Ta thickness-dependent diffusion behaviors was confirmed with X-ray photoelectron spectroscopy analysis. Along with a feasible Ta thickness model, our observations suggest that an appropriate seed layer choice is needed for high temperature annealing stability, a critical issue in the memory industry. (C) 2014 Elsevier B.V. All rights reserved.
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