Journal
OPTICS AND LASERS IN ENGINEERING
Volume 48, Issue 6, Pages 657-663Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.optlaseng.2010.02.001
Keywords
Laser cutting; Alumina substrate; Cracks; Cutting quality; Traverse speed
Categories
Ask authors/readers for more resources
In the paper, the result on femtosecond laser cutting of alumina substrate is reported. The effects of various conditions such as different focus position, traverse speed, water soluble PVA coating, on the cutting quality in terms of kerf width, taper, surface cleanness, cracks, and delamination were studied. The quality of laser cut alumina substrates was evaluated with optical microscope, SEM/EDX, and X-ray micro-CT analysis. The optimum laser cutting conditions were identified. High quality laser cutting of alumina substrates were demonstrated. The developed process has potential application in manufacturing of alumina substrate based electronic devices. (C) 2010 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available