Journal
NANOTECHNOLOGY
Volume 25, Issue 42, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0957-4484/25/42/425301
Keywords
electrical nanowelding; one-dimensional nanosolder; Sn-Ag alloy nanowire; Sn-3.5Ag; reflow
Funding
- National Basic Research Program of China [2012CB933104]
- National Natural Science Foundation of China [11274145, 11034004]
- Program for Changjiang Scholars and Innovative Research Team in University [IRT1251]
- Fundamental Research Funds for the Central Universities [lzujbky-2013-19, 2022013zrct01]
- Engineering and Physical Sciences Research Council [EP/G036748/1] Funding Source: researchfish
- EPSRC [EP/G036748/1] Funding Source: UKRI
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One-dimensional Sn-3.5Ag alloy nanosolders have been successfully fabricated by a dc electrodeposition technique into nanoporous templates, and their soldering quality has been demonstrated in nanoscale electrical welding for the first time, which indicates that they can easily form remarkably reliable conductive joints. The electrical measurement shows that individual 1D Sn-3.5Ag nanosolders have a resistivity of 28.9 mu Omega.cm. The morphology, crystal structure and chemistry of these nanosolders have been characterized at the nanoscale. It is found that individual 1D Sn-3.5Ag alloy nanosolders have a continuous morphology and smooth surface. XPS confirms the presence of tin and silver with a mass ratio of 96.54:3.46, and EDX elemental mappings clearly reveal that the Sn and Ag elements have a uniform distribution. Coveragent beam electron diffractions verify that the crystal phases of individual 1D Sn-3.5Ag alloy nanosolders consist of matrix beta-Sn and the intermetallic compound Ag3Sn. The reflow experiments reveal that the eutectic composition of the 1D Sn-Ag alloy nanowire is shifted to the Sn rich corner. This work may contribute one of the most important tin-based alloy nanosolders for future nanoscale welding techniques, which are believed to have broad applications in nanotechnology and the future nano-industry.
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