4.6 Article

SF6 plasma etching of silicon nanocrystals

Journal

NANOTECHNOLOGY
Volume 20, Issue 3, Pages -

Publisher

IOP PUBLISHING LTD
DOI: 10.1088/0957-4484/20/3/035603

Keywords

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Funding

  1. National Science Foundation [DMR-0212302, DGE-0114372, DMI-0556163]
  2. University of Minnesota
  3. NSF NNIN program

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An SF6-based plasma has been employed to perform in-flight etching of silicon nanocrystals (Si-NCs) after they were synthesized in an SiH4-based plasma. The photoluminescence of the Si-NCs blue-shifts after etching, indicating an etching-induced size reduction of the Si-NCs. It is shown that both the SF6 plasma power and the flow rate can be utilized to control the etch rate (and thus the size reduction) of the Si-NCs. The SF6 etched Si-NCs show only low concentrations of residual impurities other than fluorine. Quantum yields as high as 50% have been observed from these SF6 etched Si-NCs despite oxidation.

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