4.8 Article

Self-Assembly-Induced Formation of High-Density Silicon Oxide Memristor Nanostructures on Graphene and Metal Electrodes

Journal

NANO LETTERS
Volume 12, Issue 3, Pages 1235-1240

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/nl203597d

Keywords

Block copolymer; self-assembly; resistive memory; nanodot; Pt; graphene

Funding

  1. National Research Foundation of Korea (NRF)
  2. Ministry of Education, Science and Technology (MEST) [2011K000623, SIRC-2011-0031852]
  3. Smart IT Convergence System Research Center
  4. Ministry of Knowledge Economy (MEK)
  5. Korea Research Council for Industrial Science and Technology (ISTK) [B551179-09-07, 10040038]
  6. Korea government
  7. Korea Evaluation Institute of Industrial Technology (KEIT) [10040038] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

Ask authors/readers for more resources

We report the direct formation of ordered memristor nanostructures on metal and graphene electrodes by a block copolymer self-assembly process. Optimized surface functionalization provides stacking structures of Si-containing block copolymer thin films to generate uniform memristor device structures. Both the silicon oxide film and nanodot memristors, which were formed by the plasma oxidation of the self-assembled block copolymer thin films, presented unipolar switching behaviors with appropriate set and reset voltages for resistive memory applications. This approach offers a very convenient pathway to fabricate ultrahigh-density resistive memory devices without relying on high-cost lithography and pattern-transfer processes.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.8
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available