Journal
SENSORS
Volume 15, Issue 9, Pages 23459-23476Publisher
MDPI
DOI: 10.3390/s150923459
Keywords
flexible electronics; roll-to-roll; peel-off; flexible sensors
Funding
- NSF Center for Science of Information [NSF CCF-0939370]
- National Science Foundation [NSF SMA-1451221]
- Bill and Melinda Gates Foundation [GCF-OPP1061388]
- Naval Medical Research Center [W911QY-12-C-0090]
- Gerber Foundation [GF-554-3288]
- Army Research Office [ARO-62793-RT-REP]
- Hartwell Foundation
- Kavli Foundation
- National Science Foundation Graduate Research Fellowship [2012137216]
- UCSD Institute of Engineering and Medicine Graduate Fellowship
- Direct For Social, Behav & Economic Scie
- SBE Off Of Multidisciplinary Activities [1451221] Funding Source: National Science Foundation
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New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach.
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