4.4 Article

Recent progress in high performance and reliable n-type transition metal oxide-based thin film transistors

Journal

SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Volume 30, Issue 2, Pages -

Publisher

IOP PUBLISHING LTD
DOI: 10.1088/0268-1242/30/2/024002

Keywords

field-effect transistors; metal oxide; high performance

Funding

  1. Korea Science and Engineering Foundation (KOSEF) grant - Korean government (MEST) [2012R1A2A2A02005854]
  2. MKE/KEIT [10041041]
  3. Ministry of Public Safety & Security (MPSS), Republic of Korea [R0346-15-1008] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [2012R1A2A2A02005854] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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This review gives an overview of the recent progress in vacuum-based n-type transition metal oxide (TMO) thin film transistors (TFTs). Several excellent review papers regarding metal oxide TFTs in terms of fundamental electron structure, device process and reliability have been published. In particular, the required field-effect mobility of TMO TFTs has been increasing rapidly to meet the demands of the ultra-high-resolution, large panel size and three dimensional visual effects as a megatrend of flat panel displays, such as liquid crystal displays, organic light emitting diodes and flexible displays. In this regard, the effects of the TMO composition on the performance of the resulting oxide TFTs has been reviewed, and classified into binary, ternary and quaternary composition systems. In addition, the new strategic approaches including zinc oxynitride materials, double channel structures, and composite structures have been proposed recently, and were not covered in detail in previous review papers. Special attention is given to the advanced device architecture of TMO TFTs, such as back-channel-etch and self-aligned coplanar structure, which is a key technology because of their advantages including low cost fabrication, high driving speed and unwanted visual artifact-free high quality imaging. The integration process and related issues, such as etching, post treatment, low ohmic contact and Cu interconnection, required for realizing these advanced architectures are also discussed.

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