Journal
SCRIPTA MATERIALIA
Volume 100, Issue -, Pages 17-20Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2014.11.039
Keywords
Soldering; Synchrotron radiation; Intermetallic compounds; Phase transformations; Kinetics
Categories
Funding
- University of Queensland (UQ)-Nihon Superior (NS) collaborative research program
- JSPS, Japan [24226018]
- Australian Synchrotron International Synchrotron Access Program [AS/IA142/8198]
- Australian government
- Malaysian Education Ministry
- Universiti Malaysia Perlis (UniMAP)
- [2014A1540]
- [2014A1541]
- [2014A1114]
Ask authors/readers for more resources
In situ observations of the reaction between solid Cu in contact with molten Sn-0.7 wt.% Cu were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting, the rapid dissolution of Cu adjacent to the solid liquid interface was followed by near-instantaneous interfacial intermetallic compound (IMC) formation. The kinetics of IMC formation were also elucidated. The results provide direct experimental evidence of the sequence of events in the dissolution reaction and subsequent diffusion, and in particular of the growth mechanisms of the IMC layer. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
