Journal
SCRIPTA MATERIALIA
Volume 101, Issue -, Pages 76-79Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2015.01.023
Keywords
Copper alloys; Nanostructure; Worn subsurface microstructure; Dynamic recrystallization; Wear
Categories
Funding
- National Natural Science Foundation of China [51231006]
- MOST 973 Project [2012CB932201]
- Danish-Chinese Center for Nano-metals [51261130091]
- Key Research Program of Chinese Academy of Sciences [KGZD-EW-T06]
- Shenyang National Laboratory for Materials Science
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The sliding wear resistance of Cu-2.2 wt.% Al alloy can be remarkably enhanced by controlling subsurface dynamic recrystallization (DRX) process. The wear volume decreases from 3.1 x 10(7) to 0.9 x 10(7) mu m(3) when the DRX grain size increases from 0.28 to 0.62 mu m induced by dynamic plastic deformation and subsequent annealing. The enhanced wear resistance stems from a wear mechanism transition from cracking and peeling-off of the fine-grained DRX layer to that of the topmost nanostructured mixing layer as DRX grains become coarser. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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