☆ 4.4 Article

Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2009)

Note: Only part of the references are listed.

Article Engineering, Electrical & Electronic

XX Zhang et al.

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)

Article Engineering, Manufacturing

LL Mercado et al.

IEEE TRANSACTIONS ON ADVANCED PACKAGING (2005)

Article Materials Science, Multidisciplinary

R Gooch et al.

MRS BULLETIN (2003)