Journal
MICROELECTRONICS RELIABILITY
Volume 54, Issue 11, Pages 2564-2569Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2014.06.004
Keywords
Ag-La; Wire bounding; Free air ball; Tensile properties
Funding
- Instrument Center of National Cheng Kung University
- National Science Council of Taiwan [NSC 102-2221-E-006-061]
Ask authors/readers for more resources
Silver has potential for application in the electronic packaging industry because of its great electrical and thermal properties and lower price compared to that of gold. Silver oxidizes easily, so doping lanthanum to form Ag-La alloy improves its anti-oxidation capacity. In this study, the microstructure, tensile properties, electronic flame-off (EFO) characteristics, and fusing current of Ag-La alloy wire (phi = 20 mu m) are studied. Samples annealed at three temperatures (325 degrees C, 375 degrees C, and 425 degrees C) are analyzed. According to the experimental results, after annealing at 425 degrees C, Ag-La alloy wire recrystallized, giving it a tensile strength similar to that of pure silver wire and a uniform structure. Doping lanthanum reduced the diameter of free air balls (FABs) in the EFO process. The fusing current of Ag-La wire was about 0.45 A, and the grains of Ag-La wire grew to the size of the wire diameter when a 0.4A current (90% fusing current) was applied for a long time. Ag-La alloy wire can be used in the electronic packaging industry. (C) 2014 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available