Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 7, Pages 1033-1039Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2008.04.009
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This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production. (C) 2008 Elsevier Ltd. All rights reserved.
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