One-dimensional modeling of TE devices considering temperature-dependent parameters using SPICE

Based on simplified one-dimensional steady-state analysis of thermoelectric phenomena and on analogies between thermal and electrical domains, we propose both lumped and distributed parameter electrical models for thermoelectric devices. A couple of important advantages of the presented models are that the temperature dependence of material properties is considered and that they can be easily simulated using an electronic simulation tool such as SPICE. For a single free-standing pellet, comparisons are made between SPICE simulations using the proposed models and with numerical simulations carried out with Mathematica software. Results illustrate accuracy of the distributed parameter models and show how inappropriate it is to assume, in some cases, constant material parameters for an entire thermoelectric element. (C) 2008 Elsevier Ltd. All rights reserved.