Journal
MICROELECTRONIC ENGINEERING
Volume 122, Issue -, Pages 1-4Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2014.03.013
Keywords
SiO2/TiO2/SiO2; Atomic-layer-deposition; Metal-insulator-metal capacitor; Conduction mechanism
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Funding
- National Natural Science Foundation of China [61076076]
- Specialized Research Fund for the Doctoral Program of Higher Education [20120071110033]
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A new concept of SiO2/TiO2/SiO2 (STS) sandwiched dielectrics has been successfully prepared by atomic-layer-deposition technique for high density MIM capacitor applications. Compared with pure TiO2 dielectric, the addition of ultra-thin (2 nm) SiO2 layers reduces significantly the leakage current and enhances the breakdown electric field of MIM capacitor. Accordingly, the STS MIM capacitor exhibits a high capacitance density of around 12.4 fF/mu m(2) at 100 kHz, and a leakage current density of 8.8 x 10(-7) A/cm(2) at -1 V, which is about three orders of magnitude smaller than that of the pure TiO2 MIM capacitor. Furthermore, the conduction mechanisms of the STS capacitor have been investigated, revealing that the Poole-Frenkel emission is dominated in the high field range, and the extracted energy barrier separating the traps from the conduction band is in a 0.85-0.90 eV range. (C) 2014 Elsevier B.V. All rights reserved.
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