4.4 Article

Atomic-layer-deposited SiO2/TiO2/SiO2 sandwiched dielectrics for metal-insulator-metal capacitor application

Journal

MICROELECTRONIC ENGINEERING
Volume 122, Issue -, Pages 1-4

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2014.03.013

Keywords

SiO2/TiO2/SiO2; Atomic-layer-deposition; Metal-insulator-metal capacitor; Conduction mechanism

Funding

  1. National Natural Science Foundation of China [61076076]
  2. Specialized Research Fund for the Doctoral Program of Higher Education [20120071110033]

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A new concept of SiO2/TiO2/SiO2 (STS) sandwiched dielectrics has been successfully prepared by atomic-layer-deposition technique for high density MIM capacitor applications. Compared with pure TiO2 dielectric, the addition of ultra-thin (2 nm) SiO2 layers reduces significantly the leakage current and enhances the breakdown electric field of MIM capacitor. Accordingly, the STS MIM capacitor exhibits a high capacitance density of around 12.4 fF/mu m(2) at 100 kHz, and a leakage current density of 8.8 x 10(-7) A/cm(2) at -1 V, which is about three orders of magnitude smaller than that of the pure TiO2 MIM capacitor. Furthermore, the conduction mechanisms of the STS capacitor have been investigated, revealing that the Poole-Frenkel emission is dominated in the high field range, and the extracted energy barrier separating the traps from the conduction band is in a 0.85-0.90 eV range. (C) 2014 Elsevier B.V. All rights reserved.

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