Inkjetting dielectric layer for electronic applications

Printed electronics is expected to increase its market share significantly in near future. The emerging applications include e.g. display applications, RFID tags, and photovoltaic applications. A benefit of printing is the additive character of the process, which means that material is deposited only the amount that is needed. Digital printing increases flexibility of the process, because circuits are manufactured directly from a digital file, which removes need of fixed masks or patterned screens for each layout. Formation of a multilayer circuitry requires printing of conductive and insulative layers. This paper focuses on printing of a dielectric layer with an inkjet printer. Six sigma DMAIC approach was applied during the process characterization and analysis. The study began by defining the process parameters and evaluating their importance to the outputs. Highest rated parameters were taken into consideration and a design of experiments was established. Measured values were analyzed and it was observed which parameters had the highest effect on the outputs. The results were further verified and it was observed that electrically the printed structures were successful. (C) 2009 Elsevier B.V. All rights reserved.