Inkjet printed dielectrics for electronic packaging of chip embedding modules

The inkjet printing of a dielectric layer as part of an assembling process for a semiconductor device was evaluated. This layer embeds a chip so that a space-saving package with surface conformal conductive paths instead of wire bonds can be designed. Three different polymer solutions were tested whereas the polyimide ink is favored due to the high thermal stability and dielectric strength of the printed layer. By multiple printing of dielectric layers on top of each other a sufficient layer thickness and cover of the chip edges as well as accurate contact holes can be realized. (C) 2009 Elsevier B.V. All rights reserved.